All Answers: [pakgrid] CHINASSL2013 Call For Papers

Dear All,

Kindly find the detailed information on Call for Papers. It is an important and prestigious plate-forum. It is desired many Pakistani scientists should participate.

Kindly disseminate generously.

Warm Regards

Zamir Awan

Counsellor

Pakistan Embassy

Beijing, China.

----- Forwarded Message -----
From: CSA会议 <hy-event@china-led.net>
To: awanzamir@yahoo.com
Sent: Tuesday, July 23, 2013 10:40 AM
Subject: CHINASSL2013 Call For Papers

<span id="misspell-11" class="mark">CHINASSL</span>2013 Call For Papers

10th China International Forum on Solid State Lighting
(CHINASSL2013)

November 11-13, 2013
China National Convention Center, Beijing, China
www.sslchina.org www.china-led.net

Call for Papers

(The paper proceeding will be published by IEEE and included in the IEEE Xplore Digital Library)

CHINASSL is the largest annual event in solid state lighting industry in China. To accelerate innovative development of LED manufacturing equipment, materials, technologies, products and application, CHINASSL strives to provide an international cooperative platform for the whole SSL industrial supply chain. It dedicates itself to expanding the targeted market for SSL industry and serving to enhance companies' value.

CONTENTS

1. Materials and Equipment Technologies
- Novel Materials for Epitaxy and Substrate
- Epitaxy Technologies for High Internal Quantum Efficiency
- MOCVD and Other LED Manufacturing Equipment
- Packaging and Other Backend Equipment
- Process Control and Cost Management

2. Technologies for Thermal Management and Reliability
- Novel Materials for Heat Dissipation
- Thermal Management Technologies
- Design for Reliability of LED Lighting System
- Field Reliability Data and Advanced Failure Analysis
- Accelerated Life Testing and Prediction Methods
- Simulation and Modeling

3. Chip and Device Techniques
- Latest Development of LED Chip Manufacturing Technologies
- LED Chip and Module Technology for Practical Applications

4. Technologies for Packaging and Modules
- Latest Development of LED Packaging Materials
- New Interconnect Technologies
- Phosphor Powder Coating Techniques
- Module and Lens Design
- Latest Development of Encapsulant
- Wafer Level Encapsulation Technology
- Multi-chip Packaging, Module Design and Optimization
- Advanced Packaging Technologies for Mass Production

5. Driver, Power Supply and Control Technologies
- Power Management and High Efficiency Driving Solutions
- Solutions for Lighting System Integration and Intelligent Control
- Wireless Communications

6. LED Product Design
- Optical Design of LED Luminaires

- System Architecture and Design
- System Simulation, Modeling and Design
- Multi-physics Modeling and Simulation
- Design for System Testability
- Environmental-Friendly Design for Sustainability, Recycling and Reassembly

7. LED Lighting Project Design
- Innovative Conceptual Design and Methodologies for Lighting
- New Technologies and Processes in Lighting Design
- Design Software Development
- Analysis on Illumination and Control of Lighting Projects
- Efficient, Energy-saving and Environment-friendly Measurements in Lighting Design
- Typical Cases of Lighting Projects

8. Applications of LED Display
- Latest Technologies for LED Display Applications
- LED Backlight Technologies for Large-size LCD Display
- LED Technologies for Projection
- LED Technologies for Flash Light on Mobile Phones
- Medical Imaging

9. LED Display, Lighting, Intelligent System and Innovative Applications
- High Efficiency LED Street Lighting and Tunnel Lighting
- LED Interior Lighting Technology
- LED Automotive Lighting
- Energy-saving LED Lighting Systems
- New Solar LED Technologies
- Visual Research on LED Lighting Applications
- New LED Applications beyond Lighting (Stage, Agriculture, Health and Well-being, etc.)

10. OLED Display and Lighting Technologies & Applications
- High efficiency OLEDs materials
- Device engineering for efficient and stable OLEDs
- White OLEDs and related techniques for high performance lighting
- Advanced coating techniques for OLEDs display and lighting
- OLEDs application in high-end displays

REVIEW PROCEDURE
1. Authors submit extended abstracts.
2. Authors will be informed of the paper acceptance: Oral Presentation, Poster Presentation and Conference Proceedings.
3. Authors prepare final submissions depending on the following status:
① Oral Presentations: authors need to prepare paper and presentation files (PPT/PDF)
② Poster Presentations: authors need to prepare paper and poster files (The Organizing Committee will number the posters and inform the authors. Authors need to prepare posters according to the template and bring the hardcopy posters to the designated Poster Display area for wall mounting, and the special arranged time period for poster communication is 17:30-18:30, Nov. 12, 2013).
③ Conference Proceedings: the conference proceedings will be published by a renowned international publisher and included in a digital library. All accepted papers will be included in the conference proceedings, and authors have to prepare final papers according to the guidelines and given template.

Note:
The template can be downloaded from the website of CHINSSL2013: http://forum.sslchina.org. Authors are required to prepare papers and other materials based on the provided template and to observe the deadline strictly.

PAPER REQUIREMENTS
Basic Requirements
① The paper should not have been published in other technical publications or by other academic conferences.
② The paper should contain a concise description of the objectives of the study, method of approach, significant results and conclusions.

Abstract Submission
Authors are required to submit extended abstract according to the paper format template given on the conference website.

Paper Format
Among the above "CONTENTS", the papers should adopt Word format. The total pages of the paper are limited to 4.

Language of Abstracts, Posters and Papers
Among the above "CONTENTS":
① Abstracts/posters/papers have to be in English.
② Both Chinese and English are acceptable for oral presentations, but only English can be used for the presentation files (PPT/PDF) and conference proceedings.
Note: No commercial promotions allowed for specific companies and products; otherwise, the papers will not be selected for oral presentations and conference proceedings.

IMPORTANT DATES & METHOD OF SUBMISSION
1. Deadline for abstract submission: August 15, 2013.
2. Paper Acceptance Notification: August 31, 2013.
3. Deadline for softcopy submission of papers, presentations and posters: September 20, 2013.
4. Please submit the above materials via e-mail to Chinassl.forum@gmail.com (single email attachment is 20M at maximum).

CONTACT
China Solid State Lighting Alliance (CSA)
Miss Angie JIN
Add: No. A35, QingHua East Road, Haidian District, Beijing, 100083, China
Tel: +86 10 82387600 - 501 Fax: +86 10 82388580
E-mail: Chinassl.forum@gmail.com jinly@china-led.net